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NTC Hybrid Microelectronics Chip ThermistorsThe QTC11 NTC chip thermistors are designed for die attach and wire-bonding requirements found in today?s hybrid microelectronics circuits. The QTC11 series is offered in a gold or silver termination finish for high-reliability conductive epoxy/wire bonded attachment.
Applications may include localized temperature sensing, temperature compensation, protection, and frequency control for sensitive communications systems and infrared sensing equipment.
The QTC11 Series is available for applications requiring narrow band, temperature point matching control and is also available in a military grade DSCC (Defense Supply Center Columbus) version. Contact Sequoia Technology for details.