QTI QTC11

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Key Features
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Details

PTC Hybrid Microelectronics Chip Thermistors PTC Silicon Die thermistors are used in wire-bonding and specialized reflow-soldering applications.

Board attachment by either wire bonding, conductive epoxy, or a combination of both may be used. Solder attachment may be performed using different solder configurations, however, it is not recommended.

  • Positive Temperature Coefficient: .7%/?C
  • Thermal Time Constant: 8 seconds max in still air
  • *Dissipation Constant: 2 mW/?C min in still air
  • *Power Rating: .0625 W at 25?C, derate to 0 W at 125?C
  • Resistance @25?C: 10 ohm to 10K ohm
  • Operating temperature range: -55?C to 125?C
  • Storage temperature range: -65?C to 150?C
  • *Thermal Time Constant and Dissipation Constant may vary depending on mounting
  • Max Dimensions: .038 x .038 x .072 +/-.010. See individual drawing for actual part dimensions
  • RoHS Compliant
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